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 P-Channel Power MOS FET DMOS Structure Low On-State Resistance : 0.17 (max) Ultra High-Speed Switching Gate Protect Diode Built-in SOT - 89 Package
Applications Notebook PCs Cellular and portable phones On - board power supplies Li - ion battery systems
General Description
The XP162A12A6PR is a P-Channel Power MOS FET with low on-state resistance and ultra high-speed switching characteristics. Because high-speed switching is possible, the IC can be efficiently set thereby saving energy. In order to counter static, a gate protect diode is built-in. The small SOT-89 package makes high density mounting possible.
Features
Low on-state resistance : Rds (on) = 0.17 ( Vgs = -4.5V ) Rds (on) = 0.3 ( Vgs = -2.5V ) Ultra high-speed switching Operational Voltage : -2.5V Gate protect diode built-in High density mounting : SOT - 89
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Pin Configuration
Pin Assignment
PIN NUMBER 1 2 3 PIN NAME G D S FUNCTION Gate Drain Source
1 G
2 D
3 S
SOT - 89 Top View
Equivalent Circuit
Absolute Maximum Ratings
Ta=25 C
O
PARAMETER Drain - Source Voltage Gate - Source Voltage Drain Current (DC) Drain Current (Pulse) Reverse Drain Current Continuous Channel Power Dissipation (note)
SYMBOL Vdss Vgss Id Idp Idr Pd Tch Tstg
RATINGS -20 + 12 -2.5 -10 -2.5 2 150 -55 to 150
UNITS V V A A A W C C
1
2
P - Channel MOS FET ( 1 device built-in )
3
Channel Temperature Storage Temperature
O
O
( note ) : When implemented on a ceramic PCB
Electrical Characteristics
DC characteristics
PARAMETER Drain Cut-off Current Gate-Source Leakage Current Gate-Source Cut-off Voltage Drain-Source On-state Resistance ( note ) Forward Transfer Admittance ( note ) Body Drain Diode Forward Voltage ( note ) : Effective during pulse test. SYMBOL Idss Igss Vgs (off ) Rds ( on ) | Yfs | Vf CONDITIONS Vds = - 20 , Vgs = 0V Vgs = 12 , Vds = 0V Id = -1mA , Vds = - 10V Id = - 1.5A , Vgs = - 4.5V Id = - 1.5A , Vgs = - 2.5V Id = - 1.5A , Vds = - 10V If = - 2.5A , Vgs = 0V - 0.5 0.13 0.22 4 - 0.85 - 1.1 MIN TYP MAX - 10 10 - 1.2 0.17 0.3 Ta=25C UNITS A A V S V
Dynamic characteristics
PARAMETER Input Capacitance Output Capacitance Feedback Capacitance SYMBOL Ciss Coss Crss Vds = - 10V , Vgs = 0V f = 1 MHz CONDITIONS MIN TYP 310 200 90 MAX Ta=25C UNITS pF pF pF
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Switching characteristics
PARAMETER Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time SYMBOL td ( on ) tr td ( off ) tf Vgs = - 5V , Id = - 1.5A Vdd = - 10V CONDITIONS MIN TYP 5 15 55 55 MAX Ta=25C UNITS ns ns ns ns
Thermal characteristics
PARAMETER Thermal Resistance ( channel - surroundings ) SYMBOL Rth ( ch - a ) CONDITIONS Implement on a ceramic PCB MIN TYP 62.5 MAX UNITS C / W
Electrical Characteristics
Drain Current vs. Drain/Source Voltage Drain Current vs. Gate/Source Voltage
Drain/Source On-State Resistance vs. Gate/Source Voltage
Drain/Source On-State Resistance vs. Drain Current
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Drain/Source On-State Resistance vs. Ambient Temp.
Gate/Source Cut Off Voltage Variance vs. Ambient Temp.
Electrical Characteristics
Capacitance vs. Drain/Source Voltage Switching Time vs. Drain Current
Gate/Source Voltage vs. Gate Charge
Reverse Drain Current vs. Source/Drain Voltage
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Standardized Transition Thermal Resistance vs. Pulse Width
Single Pulse


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